Sapphire Plates with Holes
We use unique laser drilling processing technique enabling no cracks in hole peripheries, accurate taper control, and smooth wall finish,we can reach 0.03mm in min and tolerance 0.003mm in min hole depend on various thickness.
Detail Information
We use unique laser drilling processing technique enabling no cracks in hole peripheries, accurate taper control, and smooth wall finish,we can reach 0.03mm in min and tolerance 0.003mm in min hole depend on various thickness.
We strive for development of sapphire drilling techniques to meet our customers’ needs.
Advantages
-Ultra-high accuracy
-Reliable process control
-Minimal or no post-processing is needed
Application
-Various Microelectromechanical systems (MEMS)
-Accelerometers for airbag sensors
-Inkjet printer heads
-Computer disk drive heads
-Projection display chips
-Blood pressure sensors
-Optical switches
-Microvalves
-Biosensors
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